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Understanding Thermal Conductive Adhesives for Complex Designs

To meet the electronic system's rising requirements, thermal conductive glue or adhesives has played an important role. These adhesives were traditionally used as fastening materials, but now are widely applied in bonding and enclosing in almost every segment, including, medical, aerospace, military, automotive, and many others.

 

With the semiconductor industry getting close to the higher-density, smaller devices, the manufacturers have been facing bigger challenges while assembling the package, die, and other components into products for coping with increased heat loads. With advancements in silicones, epoxies, and other materials, manufacturers have found adhesives or glue to be able to match almost all the combination requirements for thermal, environmental, and structural consistency.

 

Progress in semiconductor process technologies has resulted in faster, high-density devices that have increased heat loads in target designs. In addition to their use in power electronics and solar energy, thermal conductive glue or adhesives have been an important part of the prompt growth of the LED lighting industry.

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Manufacturing Needs

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Adhesives have been able to deliver a broad range of performance-based characteristics needed for manufacturing suitability and protection. One of the most important stresses in an electronic assembly can be experienced by the interface between the package and die. With the link of dissimilar materials, the differences in the CTE (Coefficient of Thermal Expansion) in the materials results in stress and strain, eventually weakening the link between them. Adhesives with the right CTE, the mismatch of thermal expansion between the package and die can be reduced, resulting in stress reduction while offering structural support for the assembly.

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Thermal Issues

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With the increasing demand for more competent thermal management, the demand for adhesives effective in guiding heat away from sensitive devices. Adhesive suppliers usually determine the thermal properties of the material concerning the bulk thermal conductivity. This describes the heat-transfer ability of the material, through itself.

 

In the product assembly, one more important and practical feature is the thermal resistance of the material. The thermal resistance of the material explains the ease and comfort with which heat is transferred across the interface between the component surface and the material, then across the material, and finally across the interface between the material and the package.

 

Additionally, in any product assembly, if it is a die attached to the package or the component to a heat sink, the bond's thickness and the surface's nature can hinder heat transfer.

Hence, a thin bond line is considered and favored over a thick one as it helps in the reduction of thermal resistance and providing reduced stress at the bond joint's corners. This is why manufacturers are looking for the thinnest bond lines to join materials.

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Final Consideration

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Although thermal conductive glue or adhesives have played an essential role in electronics manufacturing, industry trends have raised more important requirements for these materials. Thermal conductive glue and adhesives support a wide variety of thermal management needs and manufacturing assemblies.

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